The Emergence of 2.5D Custom SOCs and Chiplets in AI and HPC Applications

2021 promises to be the breakthrough year when 2.5D based custom SOCs and chiplets will play a very prominent role in turbo-charging cloud/AI, HPC, networking and storage applications. Join us for this webinar to learn more about how Alphawave Semi is collaborating with our customers and partners to drive domain-specific innovations in Die-to-Die (D2D) IP, custom silicon and advanced package design methodologies.

Key Learnings

Die-to-Die connectivity, various package options

Target Audience

Designers, Architects, Marketing, Package engineers


Sudhir Mallya, VP, Product & Corporate Marketing
Sudhir Mallya is Vice President of Corporate and Product Marketing. He is responsible for custom silicon product marketing, technology roadmaps and business model innovation, corporate marketing initiatives, and strategic customer and partner alliances. He was previously at Toshiba where he led their North American silicon BU with a focus on data center and automotive applications. He is based in Silicon Valley and has held executive positions in engineering, marketing, and business development at leading semiconductor companies including Renesas and NEC. He has led multiple $100M+ global strategic customer engagements from very early concept to high volume production. He has a BSEE from the Indian Institute of Technology, Bombay, and an MSEE from the University of Cincinnati.


Daniel Nenni, Founder of
Daniel Nenni is the founder of (an open forum for semiconductor professionals) and the co-author of Fabless: The Transformation of the Semiconductor Industry. Daniel is an internationally recognized business development professional for companies involved with the fabless semiconductor ecosystem.