WEBINAR: Differentiated Edge AI with OpenFive and CEVA
OpenFive is hosting a webinar with CEVA on November 12th to talk about how OpenFive’s vision platform, leveraging CEVA vision and AI solutions. Which can get you to a differentiated solution for your product with as much or as little silicon participation on your part as you want. I talked briefly to Jeff VanWashenova (CEVA Sr. Dir of AI and Computer Vision) to get a sense of the opportunity. He sees a lot of interest from system product teams in automotive Tier1s and in other edge applications. These teams want to put differentiated high performance and low power AI at the heart of their edge products. But chip design isn’t their core skill. They need help, with vision, with AI and with a platform and silicon expertise to put the whole thing together.
That’s where the OpenFive and CEVA partnership comes in. CEVA and SiFive (the parent of OpenFive) already have an established partnership to bring AI to mainstream edge markets. CEVA is already well known in intelligent computer vision with their NeuPro architecture for CV, SLAM and wide-angle imaging applications. OpenFive adds to that the SiFive IP platform plus the silicon experience they bring with them in their previous incarnation as OpenSilicon, a full-service ASIC shop.
Between OpenFive and CEVA you have access to a turnkey design solution, all the way through manufacturing, assembly and test. While still being able to enjoy the advantage of RISC-V ISA extensions to optimize performance in the CPU core(s). Plus high performance and low power CV and neural net inferencing. You can develop and optimize your software to a platform customized to your specific needs and optimized for edge constraints.
OpenFive is a solution-centric silicon company that is uniquely positioned to design processor agnostic SoC architectures. With customizable and differentiated IP for Artificial Intelligence, Edge Computing, HPC, and Networking solutions, OpenFive develops domain-specific SoC architectures based on high-performance, highly efficient, cost-optimized IP to deliver scalable, optimized, differentiated silicon. OpenFive offers end-to-end expertise in Architecture, Design Implementation, Software, Silicon Validation and Manufacturing to deliver high-quality silicon.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies. We offer Digital Signal Processors, AI processors, wireless platforms and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. All of which are key enabling technologies for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial and IoT.
CEVA ultra-low-power IPs include comprehensive DSP-based platforms for 5G baseband processing in mobile and infrastructure, advanced imaging and computer vision for any camera-enabled device and audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and IMU solutions for AR/VR, robotics, remote controls, and IoT. In artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For wireless IoT, we offer the industry’s most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax) and NB-IoT.