Chiplet Summit 2025
January 21 – 23, 2025
Santa Clara Convention Center
About the Chiplet Summit:
The Chiplet Summit is an annual event that unites the leading players in the chiplet, AI, and interconnect / compute sectors to address the key challenges facing the industry. Now in its third year, the event has grown considerably, with the number of exhibitors rising by more than a third since 2023.
Alphawave Semi will showcase its recent advances in UCIe for 3 nm processes, HBM and I/O chiplets. Visitors to its booth #500, will be able to discuss how new advances are reducing networking bottlenecks in data centers. Attendees will also see a range of demonstrations including:
- Design co-optimization of HBM3 achieving a bandwidth over 9.6 G
- Multi-protocol I/O chiplet running PCIe, CXL and Gen6 optical interconnects for memory
- UCIe 3 nm test chip with standard and advanced packaging, both running at 24G
- Conceptual passive accelerator card demonstration
At the show, Alphawave Semi’s CTO, Dr. Tony Chan Carusone, will also deliver a keynote on ‘Scaling Connectivity for Chiplet-Based AI Systems’ with the company’s technical experts also presenting multiple papers/tutorials on die-to-die interfaces, focusing on the open UCIe standard. Letizia Giuliano, VP, IP Product Marketing & Management, will take part in a panel debate examining the opportunities and challenges to make chiplets the most viable IC development model possible.
List of Alphawave presentations and tutorials
Keynotes:
Wednesday 22nd
10:50am – Scaling Connectivity for Chiplet-Based AI Systems, Alphawave Semi (Tony Chan Carusone)
Location GAB J/K
Companies attending the keynotes can also discover Alphawave Semi’s initiatives to speed up chiplet development through keynote speeches and discussions led by Arm and Keysight.
Presentations
Tuesday 21st :
8:30am session – Implementing UCIe with Standard and Advanced Packaging (Daniel Lambalot)
Location: GAMR 3
8:30am session – Introduction to Die-to-Die Interfaces (Letizia Giuliano)
Location: GAB J/K
1:00pm session – Unifying Chiplets: Enabling Die to Die Connectivity (Sue Hung Fung)
Location: GAMR 3
1:00pm session – The Open Chiplet Economy Opens its Marketplace (Michael Klempa)
Location: GAB J
Wednesday 22nd:
3:45pm session – Annual Update on Die-to-Die Interfaces (Letizia Giuliano)
Location: GAB K
5:00pm session – Reusable Family of Elements for Chiplet-Based Design (Sue Hung Fung)
Location: GAMR 2
Thursday 23rd:
9:00am session – Unlocking XPU Performance with Chiplets (Ilamparidhi I and Michael Klempa)
Location: GAMR 1
9:00am session – Making Chiplets a Viable Market (Letizia Giuliano)
Location: GAB J/K
2:00pm session – Using HBM (High Bandwidth Memory) in AI Acceleration (Soni Kapoor)
Location: GAMR 2
To learn more about the event, click here.
To register as an attendee, click here.
To learn about other events where Alphawave Semi is participating, click here.
To contact us, click here.