AresCORE is a market leading extremely low-power, low-latency interface IP designed by Alphawave Semi for very high bandwidth connections between two dies that are on the same package. Its main target applications include, but are not limited to:
AresCORE 16G D2D IP implements a wide-parallel and clock forwarded PHY interface for multichannel interconnections up to 16 Gbps. The PHY IP is configurable to support Universal Chiplet Interconnect Express (UCIe) providing customers a D2D solution that is compliant with industry standards.
The AresCORE 16G D2D IP can be configured to support advanced packaging such as Chip-on-Wafer-on-Substrate (CoWoS) and Integrated-Fan-Out (InFO) for maximum density, and organic substrates for the most cost-effective solution covering all market segments.
The AresCORE 16G D2D IP is an extremely power efficient low-latency interconnect allowing the connection between two dies through short-reach low-loss channels. Our proprietary architecture allows SOC teams to reduce IO complexity and save power.
The AresCORE 16G D2D IP can be composed with multiple modules to achieve high density throughput per die shoreline.
The AresCORE 16G D2D Master Controller integrates and simplifies training and calibrations, while maintaining product level flexibility.
The AresCORE 16G D2D IP is compliant with IEEE 1149.1 (JTAG) and 1149.6 (AC JTAG) boundary scan. The Built-In Self-Test (BIST), internal and external loopback, and non-destructive eye diagram provide on-chip testability and visibility into channel performance.
Die-to-die interconnects enable SOC developers to break the boundaries of the reticle limit by including multiple dies in the same package. This multi-die approach to silicon design allows for better yielding, smaller purposeful dies vs traditional SOCs. The main target applications of D2D interconnects include, but are not limited to:
Alphawave Semi™ is a global leader in high-speed connectivity for the world’s technology infrastructure. Our IP and custom silicon solutions meet the needs of global tier-one customers in data centers, compute, networking, AI, 5G, autonomous vehicles, and storage.
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