112 gigabit per second connectivity transmission speed for transmission of data


224 gigabit per second connectivity transmission speed for transmission of data


Application-specific integrated circuit (or system on chip (“SOC”)) that integrates all or most components of a computer or other electronic system


Clock-data recovery, component of a connectivity process, which extracts timing information from a serial data stream to allow the receiving circuit to decode the transmitted symbols chiplet smaller modular pieces of silicon, or chiplets, utilised in a design technique to break integrated circuits into smaller pieces that can be individually designed and integrated together using die-to-die interfaces


Central processing unit, or microprocessor, of electronic circuitry that executes instructions comprising a programme


Compute express link, open standard interconnection for high-speed central processing unit-to-device and CPU-to-memory, for data centres


Digital signal processing capabilities, enabled to perform a wide variety of signal processing operations


Dynamic random-access memory, semiconductor memory that stores each bit of data in a memory cell consisting of a capacitor and a transistor


Fin field-effect transistor, semiconductor gate design for transmission of information

Form factor

Design aspect that defines and prescribes the size, shape, and other physical specifications of hardware components


Field programmable gate arrays, an integrated circuit designed to be configured by a customer or a designer after manufacturing


Graphics processing unit, the specialised electronic circuit utilised in the creation of images for output to a display device


Infrastructure-as-a-service, comprising the provision of virtualised computing resources via cloud computing


Integrated device manufacturer, a semiconductor company which designs,manufactures and sells integrated circuit product


Institute of Electrical and Electronics Engineers, an electronics industry body, including educational and technical advancement of electrical and electronic engineering, telecommunications, computer engineering and allied disciplines, including standardisation


Internet of things, network of physical objects that are embedded with sensors, software and other technologies for the purpose of connecting and exchanging data with other devices and systems over the internet

IP/silicon IP

Intellectual property core, IP core, or IP block is a reusable unit of logic, cell, or integrated circuit layout design


Machine-to-machine connectivity, permitting IoT data exchange without human interface or interaction modulation schemes specific technique of signal modulation when converting data into electrical signals for transmission


Technology nodes, or process technologies, referring to the specific semiconductor manufacturing process and its design rules, generally designated by the process’ minimum feature size (in nanometres)


Non-recurring engineering, in reference to revenue earned in respect of onetime early-stage customer services including for research, design, development and testing


Non-volatile memory interface for accessing external non-volatile storage media utilising PCIe connectivity standard


Original equipment manufacturer that produces systems, parts or equipment utilised in the production of another device or product


Optical Internetworking Forum, an electronics industry body promoting standardisation, including for optical networking products, network processing elements, and component technologies


Pulse amplitude modulations, form of signal modulation where the message information is encoded in the amplitude of a series of signal pulses, such as PAM2 (aka NRZ), PAM4, PAM6 and PAM8


PCI-Express, a high-speed serial computer expansion bus standard


Physical interface or “physical layer” processor interface in an integrated circuit


Phase-locked loop, component of a connectivity block providing a control system that generates an output signal whose phase is related to the phase of an input signal


Wired connectivity component to interface between integrated circuits, which converts parallel streams of data (used as connectivity within integrated circuits) to serial streams (used in longer-distance transmission outside chips) and vice versa


Special Interest Group, an electronics industry consortium responsible for specifying the Peripheral Component Interconnect, PCI-X, and PCI Express computer buses


Silicon in package, format for packaging multiple smaller dies in a SOCs


System on chip (or ASIC) that integrates all or most components of a computer or other electronic system


Semiconductor and component manufacturers that supply parts or systems directly to OEMs


In the fabrication of integrated circuits, the thin slice of semiconductor (such as a crystalline silicon) in and upon which microelectronic devices are built