PHY IP

Alphawave Semi offers the industry’s leading portfolio of multi-standard, connectivity IP covering Ethernet, PCIe, CXL, DDR5, and Die to Die (D2D) applications. These are complete silicon IP building blocks that customers license and integrate into the design of their chips. Our wired connectivity IP supports a wide range of data rates—from 1 Gbps to 224 Gbps—and multiple signaling schemes such as PAM2 (also known as NRZ), PAM4, PAM6, PAM8 and Coherent, which are used in over 30 different industry protocols/standards.

1G to 224G SerDes

Alphawave Semi offers the industry’s leading portfolio of multi-standard, connectivity IPs. These are complete silicon IP building blocks that customers license and integrate into the design of their chips. Our wired connectivity IP supports a wide range of data rates—from 1 Gbps to 224 Gbps—and multiple signaling schemes such as PAM2 (also known as NRZ), PAM4, PAM6 and PAM8, which are used in over 30 different industry protocols/standards.

PipeCORE PCI-Express and CXL PHY

The Alphawave Semi PipeCORE™ PHY IP is a high-performance, low-power, PCIe Gen1 to Gen6 PHY, that is capable of also operating at 64 Gbps PAM4 PCIe Gen6 rates. It includes a hardened PMA layer and a soft PCS layer deliverable. The PipeCORE is based on the industry leading AlphaCORE DSP architecture.

AresCORE 16G Die-to-Die (D2D) IP

AresCORE is a market-leading, extremely low-power/low-latency interface IP designed by Alphawave Semi for very high bandwidth connections between two dies that are on the same package.

SigmaCORE HBM3 PHY

The SigmaCORE High-Bandwidth Memory Generation 3 (HBM3) PHY is ideal for applications involving graphics, high-performance computing, high-end networking, and communications that require very high memory bandwidth, lower latency, and more density.

LPDDR5/4X IP Subsystem

LPDDR memory are used where area and power savings are key requirements. LPDDR also offers higher bandwidth compared to DDR counterparts. LPDDR5/4X is ideally suited for next generation computing for Artificial Intelligence (AI) inference, Edge, Internet of Things (IoT), automotive and mobile applications.