Team with experts at Alphawave Semi as much or as little as you want to bring your idea to fruition. With our end-to-end expertise spanning design to manufacturing of domain-optimized SoCs, Alphawave Semi is uniquely positioned to team with you to deliver high quality custom silicon in advanced nodes down to 3nm.
Alphawave Semi has the expertise to engage at the architecture phase and has delivered multiple customizable subsystems and entire SoCs for AI enabled applications.
Our capabilities include:
Through a combination of our internally developed, highly differentiated IP and long-standing partnership with our IP ecosystem providers, Alphawave Semi has integrated hundreds of IP into very complex domain-specific SoCs in AI, HPC, data center, networking and storage applications.
Examples of these include:
Alphawave Semi experts in Physical Design Methodologies have completed complex chip tape-outs in a variety of process nodes including 3nm, for high-performance applications in AI, HPC, data center, networking and storage.
Design Characteristics:
We partner with world-class foundries – TSMC, Global Foundries, Intel Foundry and Samsung – and offer a wide range of processes including leading-edge 3nm, 5nm, 7nm for high performance logic, and more mature nodes for analog or mixed signal applications.
Alphawave Semi is a long-standing member of TSMC’s Value Chain Aggregator (VCA) program.
Alphawave Semi collaborates with TSMC, Intel Foundry and Samsung as a member of the Arm Total Design ecosystem.
Alphawave Semi provides a complete solution from package selection through design and development, to high-volume manufacturing. We understand the importance of selecting the proper packaging solution to meet the technical and cost constraints of each design.
As part of our investment in chiplets, Alphawave Semi is also leading the revolution in advanced packaging. We have multiple ongoing engagements with advanced 2.5D packaging technologies such as TSMC Chip-on-Wafer-on-Substrate (CoWoS) and Integrated Fan-Out on Substrate (InFO_oS).
A team of fab, packaging, test and product engineers work closely with our customer to identify and select the right process technology solution for each design. After RTP (Release to Production) our global manufacturing team ensures that the products meet and exceed the yield and quality targets which is evident by the very low DPPM achieved (average 25 DPPM return rate for over 150 million units shipped).
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