AresCORE 16G Die-to-Die IP Factsheet

AresCORE 16G Die-to-Die (D2D) IP is a market leading, extremely low-power, low-latency interface IP designed by Alphawave Semi for very high bandwidth connections between two dies that are on the same package. Its main target applications include, but are not limited to:

• High Performance Computing (HPC)
• Data Centers
• Artificial Intelligence (AI)
• Networking

AresCORE 16G D2D IP implements a wide parallel and clock forwarded PHY interface for multichannel interconnections up to 16 Gbps.

The PHY IP is configurable to support the leading standards in the industry such as: Bunch of Wire (BOW), Open High Bandwidth Interface (OpenHBI) and Universal Chiplet Interconnect Express (UCIe ) — providing customers a Die-to-Die (D2D) solution that is compliant with industry standards.

AresCORE 16G D2D IP can be configured to support advanced packaging such as Chip-on-Wafer-on-Substrate (CoWoS) or Integrated-Fan-Out (InFO) for maximum density, as well as Organic Substrates for the most cost-effective solution covering all market segments.