Chiplet-Based Integration Will Support Semiconductor Next Revolution

As the semiconductor industry continues developing smaller process nodes, the economical benefits of Moore’s law are diminishing. Data-centric applications are now the driver of the electronic industry, and these applications demand increasing bandwidth, computing power, and ultimately require more transistors. We believe that chiplet-based architectures will be the solution to deliver ever-increasing processing capabilities and ultimately more transistors in a single package. In the 2000’s, Design IP vendors emerged and grew, because they supported semiconductor companies to design System-On-Chips (SoCs) by using third party IPs to integrate an ever-increasing number of functions and to meet product time to market needs. In the upcoming decade, Design IP vendors will have an ability to support their customers by now offering chiplets to help integrate, within the package, the functions needed to meet the requirements of modern-day processors. Alphawave sponsored the creation of this white paper, but the opinions and analysis are those of the author.

During the 2010-decade, the benefits of Moore’s law began to fall apart. Moore’s law stated transistor density doubled every two years, the cost of compute would shrink by a corresponding 50%. The change in Moore’s law is due to increased in design complexity the evolution of transistor structure from planar devices, to Finfets. Finfets need multiple patterning for lithography to achieve devices dimensions to below 20-nm nodes.

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