Alphawave’s CTO, Tony Chan Carusone, continues his technical talks on high-speed communications discussing the key trends in modern wireline links. Some links are continuously bringing dies closer together, which reduces power, signal integrity issues at the cost of advanced packaging techniques and yield. Conversely, there is a need for connecting dies which are getting increasingly far apart; datacenters and cloud compute, where the architectural trend is towards disaggregation. There are a few connectivity solutions which tradeoff between power, complexity, and reach. The larger trend in connectivity is the transition towards eliminating the lossy traces connecting the ASIC package to the front panel pluggable, utilizing- near-packaged and ultimately co-packaged optics.