Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership

Learn more
Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025

Learn more
Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit

Learn more
Alphawave Semi Q4 2024 Trading and Business Update
Press Release

Learn more
Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

Learn more
Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
Press Release

Learn More
9.2 Gbps HBM3E Subsystem
Press Release

Learn More
Industry-First, Multi-Protocol I/O Connectivity Chiplet
Press Release

Learn More
Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
Press Release

Learn More
Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution
Press Release

Learn more
3nm Silicon-Proven 24Gbps UCIe™ Subsystem for High-Performance AI Infrastructure
Press Release

Learn more
PCIe 7.0 Signal Generation and Measurement unveiled
Press Release

Learn more
Accelerating the
connected world.
Alphawave Semi™ is the global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure.

Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership

Learn more
Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025

Learn more
Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit

Learn more
Alphawave Semi Q4 2024 Trading and Business Update
Press Release

Learn more
Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

Learn more
Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology

Learn More
9.2 Gbps HBM3E Subsystem

Learn More
Industry-First, Multi-Protocol I/O Connectivity Chiplet

Learn More
Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet

Learn More
Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution

Learn more
3nm Silicon-Proven 24Gbps UCIe™ Subsystem for High-Performance AI Infrastructure

Learn more
PCIe 7.0 Signal Generation and Measurement unveiled

Learn more
Accelerating the
connected world.
Alphawave Semi™ is the global leader in high-speed
connectivity for the world’s technology infrastructure.

Silicon IP

Alphawave Semi offers the industry’s leading portfolio of multi-standard, connectivity IPs. These are complete silicon IP building blocks that customers license and integrate into the design of their chips.

Learn more

Chiplets

Alphawave Semi’s chiplet solutions build upon our industry-leading wired connectivity IP portfolio combined with our custom silicon and advanced packaging capabilities.

Learn more

Custom Silicon

Alphawave Semi offers spec-to-silicon capabilities and delivers custom SOC solutions that are highly optimized for power, performance and area, providing greater design flexibility and a competitive edge.

Learn more

Connectivity Products

Alphawave Semi develops industry leading PAM4 and Coherent DSP products in the most advanced technologies for all forms of data center connectivity.

Learn more

Addressing High-End Connectivity Needs

Hyperscale Data Center

The rapidly growing requirement within hyperscale data center operations for high-speed connectivity for processing drives their need to take advantage of economies of scale, attain a greater internal control over technology, and increase service differentiation. To ensure their silicon meets expected performance, they have been relying on third-party silicon IP providers like Alphawave Semi.

Data Networking

Storage

5G

An important part of the evolving wireless infrastructure architecture necessitates a build-out of a greater number of antenna units interconnected through “front-haul” links. Because of this architectural separation, a significant strain is put on the wireline network requiring very low-latency reliable connectivity. Every interface has to keep up with evolution of high-performing specialized wireless integrated circuits such as transceiver and baseband units and support a variety of standards, which Alphawave Semi IP has solutions for.

Autonomous Vehicles

Advanced driver assistance systems, in-vehicle infotainment and autonomous driving systems are driving the need for interconnected cameras, sensors (such as LiDARs and RADARs), displays and on-board processors. High-speed wired connectivity is key to moving this data from sensors to processing nodes and interconnecting the automotive components with low latency and resilience to noise and interference under harsh environments. Alphawave Semi has proven IP that meets these challenging requirements.

Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership

Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025

Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit

Alphawave Semi Q4 2024 Trading and Business Update

Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology

9.2 Gbps HBM3E Subsystem

Industry-First, Multi-Protocol I/O Connectivity Chiplet

Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet

Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution

3nm Silicon-Proven 24Gbps UCIe™ Subsystem for High-Performance AI Infrastructure

PCIe 7.0 Signal Generation and Measurement unveiled

Accelerating the connected world.

Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership

Alphawave Semi to Showcase Innovations and Lead Expert Panels on 224G, 128G PCIe 7.0, 32G UCIe, HBM 4, and Advanced Packaging Techniques at DesignCon 2025

Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit

Alphawave Semi Q4 2024 Trading and Business Update

Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity

Unveiling the Industry’s First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology

9.2 Gbps HBM3E Subsystem

Industry-First, Multi-Protocol I/O Connectivity Chiplet

Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet

Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution

3nm Silicon-Proven 24Gbps UCIe™ Subsystem for High-Performance AI Infrastructure

PCIe 7.0 Signal Generation and Measurement unveiled

Accelerating the connected world.

Silicon IP

Chiplets

Custom Silicon

Connectivity Products

Addressing High-End Connectivity Needs

Hyperscale Data Center

Supportive and Responsible Work Culture at Alphawave Semi

Social Commitment

Investor Relations

Work Culture

Follow us

Accelerating the
connected world.

Accelerating the
connected world.