Q3-2024-Highlights from Alphawave Semi: Accelerating the Future

Welcome to the first in a new series of the Waverider Pulse, Alphawave Semi’s quarterly newsletter.

In this new format, we will tackle a single topic in each issue, detailing white papers, blogs, technical articles and innovations relevant to the focus subject. This quarter, we examine chiplets and their die-to-die connectivity standard UCle.

Whitepaper: Will Chiplet Adoption Mimic IP Adoption?

Extensive range of IP helps minimize Soc chip-based architectures and design IP played a huge role in the IC advances of the 2000s. Will chiplet-based architectures soon play the same role? How can we predict the adoption timeframe and what will be the key enablers?

 

Webinar: Achieving HPC With Al Chiplets Through UCle D2D Interconnects

UCle die-to-die interconnects benefit from enhanced interoperability with low latencies and low power consumption levels. But what are the challenges and driving forces behind the development of disaggregated systems?

 

First Silicon-Proven 3nm, 24Gbps UCle IP Subsystem with TSMC CoWoS Technology now Available

This multi-protocol subsystem was created in collaboration with TSMC to meet the demands of hyperscale, HPC, and Al infrastructure. It delivers a bandwidth density of 8 Tbps/mm, plus a D2D data rate of 24 Gbps.

 

Podcast: Al Connectivity & Chiplet Innovation

Listen to Alphawave Semi’s VP of IP Product Marketing & Management, Letizia Giuliano, discuss recent advances in Al connectivity, chiplet design and the importance of open standards. Recorded at the Al Hardware Summit – with Tech Arena’s Allyson Klein.

 

Additional Resources