Achieving High Performance Compute with AI Chiplets Through UCIe Die-to-Die Interconnects – Webinar

In this webinar, we will explore the remarkable world of Die-to-Die interconnects, the driving force behind the development of disaggregated systems. These technologies offer unparalleled flexibility, scalability, and resource utilization in the realm of high-performance computing.

Join us as we uncover the key motivations for adopting disaggregated systems and the challenges they present. We will delve into the core principles of UCIe Die-to-Die interconnects, including their low latency, low power consumption, and interoperability. Discover how these interconnects can revolutionize diverse domains such as data centers, edge computing, artificial intelligence, autonomous systems, and high-performance computing.

Furthermore, we will explore the critical intellectual property building blocks that make these innovations possible, from advanced chip packaging techniques to interface protocols and system-level integration methodologies.

By the end of this webinar, you will gain a comprehensive understanding of the transformative potential of low-latency, low-power, and interoperable Die-to-Die interconnects. Join us in shaping the future of high-performance computing systems!

Letizia Giuliano
VP of Product Marketing
Alphawave Semi