High Speed Communications Part 7 – Die-to-Die Interconnect Video

Alphawave’s CTO, Tony Chan Carusone, continues his technical talks on high-speed communications discussing co-packaging (2.5D Integration) strategies, and how these technologies can increase density with various packaging and routing techniques. Utilizing silicon interposer technology, throughput density of 2 Tbps/mm is reasonably achieved with high efficiency and low noise.